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article · 2006

Investigations of all lead free IGBT module structure with low thermal resistance and high reliability

This paper presents all lead free IGBT module structure with low thermal resistance and high reliability. Using thick copper foil alumina DCB, Sn/Ag/In solde...

4 citationsDOI: https://doi.org/10.1109/ispsd.2006.1666118
Investigations of all lead free IGBT module structure with low thermal resistance and high reliability