article · 2007
Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process
Au surface finish is very common used as a protection layer on pad. In the traditional reflow process, Au is dissolved into solder, and AuSn <sub xmlns:mml="...
0 citationsDOI: https://doi.org/10.1109/icept.2007.4441450