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article · 2007

Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process

Au surface finish is very common used as a protection layer on pad. In the traditional reflow process, Au is dissolved into solder, and AuSn <sub xmlns:mml="...

0 citationsDOI: https://doi.org/10.1109/icept.2007.4441450
Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process