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article · 2002

CAD for HMICs/MMICs including multilayer structures and MCM technology

The use of three and more conductor levels in RF, microwave and mm-wave hybrid (HMICs) and monolithic (MMICs) integrated circuits (ICs) and associated recent...

0 citationsDOI: https://doi.org/10.1109/mikon.1998.738469
CAD for HMICs/MMICs including multilayer structures and MCM technology