{"associated_institutions":[{"country_code":"TW","display_name":"United Microelectronics (Taiwan)","id":"https://openalex.org/I4210161555","relationship":"parent","ror":"https://ror.org/0580qje17","type":"company"}],"authors_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I77566578/authors","cited_by_count":28847,"collaborators_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I77566578/collaborators","country_code":"US","counts_by_year":[{"cited_by_count":0,"oa_works_count":18,"works_count":52,"year":2026},{"cited_by_count":157,"oa_works_count":57,"works_count":185,"year":2025},{"cited_by_count":222,"oa_works_count":21,"works_count":48,"year":2024},{"cited_by_count":443,"oa_works_count":25,"works_count":43,"year":2023},{"cited_by_count":220,"oa_works_count":13,"works_count":23,"year":2022},{"cited_by_count":211,"oa_works_count":20,"works_count":27,"year":2021},{"cited_by_count":135,"oa_works_count":4,"works_count":14,"year":2020},{"cited_by_count":313,"oa_works_count":5,"works_count":19,"year":2019},{"cited_by_count":84,"oa_works_count":4,"works_count":4,"year":2018},{"cited_by_count":98,"oa_works_count":0,"works_count":14,"year":2017},{"cited_by_count":438,"oa_works_count":6,"works_count":20,"year":2016},{"cited_by_count":162,"oa_works_count":1,"works_count":17,"year":2015},{"cited_by_count":124,"oa_works_count":6,"works_count":24,"year":2014},{"cited_by_count":310,"oa_works_count":7,"works_count":37,"year":2013},{"cited_by_count":374,"oa_works_count":4,"works_count":35,"year":2012},{"cited_by_count":234,"oa_works_count":4,"works_count":27,"year":2011},{"cited_by_count":99,"oa_works_count":5,"works_count":32,"year":2010}],"counts_by_year_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I77566578/counts_by_year","created_date":"2016-06-24T00:00:00.000Z","display_name":"United Microelectronics (United States)","display_name_acronyms":["UMC"],"display_name_alternatives":["United Microelectronics (United States)"],"geo":{"city":"Sunnyvale","country":"United States","country_code":"US","geonames_city_id":"5400075","latitude":37.383331298828125,"longitude":-122.00658416748047,"region":"California"},"homepage_url":"http://www.umc.com/english/","id":"https://openalex.org/I77566578","ids":{"grid":"grid.481779.4","openalex":"https://openalex.org/I77566578","ror":"https://ror.org/00vrhw316","wikidata":"https://www.wikidata.org/wiki/Q143616","wikipedia":"https://en.wikipedia.org/wiki/UMC_(company)"},"image_thumbnail_url":"https://commons.wikimedia.org/w/index.php?title=Special:Redirect/file/UMC-Logo.svg\u0026width=300","image_url":"https://commons.wikimedia.org/w/index.php?title=Special:Redirect/file/UMC-Logo.svg","is_super_system":false,"lineage":["https://openalex.org/I4210161555","https://openalex.org/I77566578"],"repositories":[],"roles":[{"id":"https://openalex.org/I77566578","role":"institution","works_count":1149}],"ror":"https://ror.org/00vrhw316","status":"active","summary_stats":{"2yr_mean_citedness":1.3387573964497042,"h_index":66,"i10_index":487},"topic_share":[{"display_name":"Advancements in Photolithography Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11338","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0010263},{"display_name":"Integrated Circuits and Semiconductor Failure Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14117","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0009204},{"display_name":"Advancements in Semiconductor Devices and Circuit Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10558","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0008337},{"display_name":"3D IC and TSV technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11527","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0006439},{"display_name":"Semiconductor materials and devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10472","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0006217},{"display_name":"Copper Interconnects and Reliability","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Materials Science","id":"https://openalex.org/fields/25"},"id":"https://openalex.org/T11661","subfield":{"display_name":"Electronic, Optical and Magnetic Materials","id":"https://openalex.org/subfields/2504"},"value":0.0005419},{"display_name":"Electronic Packaging and Soldering Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10460","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0005051},{"display_name":"Ferroelectric and Negative Capacitance Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12808","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0005044},{"display_name":"Silicon and Solar Cell Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10624","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0004071},{"display_name":"Silicon Carbide Semiconductor Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10361","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0003956},{"display_name":"Radio Frequency Integrated Circuit Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10187","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.000369},{"display_name":"VLSI and Analog Circuit Testing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11032","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.0003439},{"display_name":"Nanofabrication and Lithography Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12224","subfield":{"display_name":"Biomedical Engineering","id":"https://openalex.org/subfields/2204"},"value":0.0003234},{"display_name":"Electrostatic Discharge in Electronics","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12495","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0003146},{"display_name":"Electromagnetic Compatibility and Noise Suppression","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11444","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0003073},{"display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T12122","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.0002628},{"display_name":"Low-power high-performance VLSI design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10363","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0002357},{"display_name":"Analog and Mixed-Signal Circuit Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10323","subfield":{"display_name":"Biomedical Engineering","id":"https://openalex.org/subfields/2204"},"value":0.0002346},{"display_name":"Thin-Film Transistor Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10623","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0002248},{"display_name":"Semiconductor materials and interfaces","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T11853","subfield":{"display_name":"Atomic and Molecular Physics, and Optics","id":"https://openalex.org/subfields/3107"},"value":0.0002138},{"display_name":"GaN-based semiconductor devices and materials","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T10099","subfield":{"display_name":"Condensed Matter Physics","id":"https://openalex.org/subfields/3104"},"value":0.0002111},{"display_name":"Neural Networks and Reservoir Computing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T12611","subfield":{"display_name":"Artificial Intelligence","id":"https://openalex.org/subfields/1702"},"value":0.0002097},{"display_name":"Advanced Power Amplifier Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11248","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0001992},{"display_name":"CCD and CMOS Imaging Sensors","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11992","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0001845},{"display_name":"Advanced Surface Polishing Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11301","subfield":{"display_name":"Biomedical Engineering","id":"https://openalex.org/subfields/2204"},"value":0.0001822}],"topics":[{"count":279,"display_name":"Semiconductor materials and devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10472","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":183,"display_name":"Advancements in Semiconductor Devices and Circuit Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10558","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":161,"display_name":"Integrated Circuits and Semiconductor Failure Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14117","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":70,"display_name":"Advancements in Photolithography Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11338","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":68,"display_name":"Photonic and Optical Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10299","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":59,"display_name":"Silicon Carbide Semiconductor Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10361","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":56,"display_name":"Silicon and Solar Cell Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10624","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":51,"display_name":"Radio Frequency Integrated Circuit Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10187","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":51,"display_name":"3D IC and TSV technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11527","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":48,"display_name":"Electronic Packaging and Soldering Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10460","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":45,"display_name":"Copper Interconnects and Reliability","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Materials Science","id":"https://openalex.org/fields/25"},"id":"https://openalex.org/T11661","score":1,"subfield":{"display_name":"Electronic, Optical and Magnetic Materials","id":"https://openalex.org/subfields/2504"}},{"count":38,"display_name":"Semiconductor materials and interfaces","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T11853","score":1,"subfield":{"display_name":"Atomic and Molecular Physics, and Optics","id":"https://openalex.org/subfields/3107"}},{"count":36,"display_name":"Advanced Surface Polishing Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11301","score":1,"subfield":{"display_name":"Biomedical Engineering","id":"https://openalex.org/subfields/2204"}},{"count":34,"display_name":"VLSI and Analog Circuit Testing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11032","score":1,"subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"}},{"count":34,"display_name":"Ferroelectric and Negative Capacitance Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12808","score":0.9999,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":33,"display_name":"Thin-Film Transistor Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10623","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":33,"display_name":"Electromagnetic Compatibility and Noise Suppression","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11444","score":0.9999,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":31,"display_name":"GaN-based semiconductor devices and materials","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T10099","score":1,"subfield":{"display_name":"Condensed Matter Physics","id":"https://openalex.org/subfields/3104"}},{"count":30,"display_name":"Optical Network Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10232","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":28,"display_name":"Microwave Engineering and Waveguides","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10262","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":28,"display_name":"Analog and Mixed-Signal Circuit Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10323","score":1,"subfield":{"display_name":"Biomedical Engineering","id":"https://openalex.org/subfields/2204"}},{"count":26,"display_name":"Low-power high-performance VLSI design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10363","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":26,"display_name":"Advanced Memory and Neural Computing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10502","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":26,"display_name":"Electron and X-Ray Spectroscopy Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Materials Science","id":"https://openalex.org/fields/25"},"id":"https://openalex.org/T12039","score":0.9998,"subfield":{"display_name":"Surfaces, Coatings and Films","id":"https://openalex.org/subfields/2508"}},{"count":25,"display_name":"Semiconductor Lasers and Optical Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11429","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}}],"type":"company","type_id":"https://openalex.org/institution-types/company","updated_date":"2026-03-30T05:59:38.000Z","works_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I77566578/works","works_count":1149}