{"associated_institutions":[],"authors_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210165530/authors","cited_by_count":1,"collaborators_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210165530/collaborators","country_code":"CN","counts_by_year":[{"cited_by_count":0,"oa_works_count":1,"works_count":1,"year":2020},{"cited_by_count":0,"oa_works_count":1,"works_count":1,"year":2014},{"cited_by_count":1,"oa_works_count":0,"works_count":6,"year":2010}],"counts_by_year_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210165530/counts_by_year","created_date":"2022-02-02T04:48:36.000Z","display_name":"Karl Mayer (China)","display_name_acronyms":[],"display_name_alternatives":["Karl Mayer (China)","卡尔迈耶"],"geo":{"city":"Changzhou","country":"China","country_code":"CN","geonames_city_id":"1815456","latitude":31.647933959960938,"longitude":119.96273040771484,"region":null},"homepage_url":"https://www.karlmayer.com/en/","id":"https://openalex.org/I4210165530","ids":{"grid":"grid.497390.0","openalex":"https://openalex.org/I4210165530","ror":"https://ror.org/05teyj036","wikidata":null,"wikipedia":""},"image_thumbnail_url":null,"image_url":null,"is_super_system":false,"lineage":["https://openalex.org/I4210165530"],"repositories":[],"roles":[{"id":"https://openalex.org/I4210165530","role":"institution","works_count":8}],"ror":"https://ror.org/05teyj036","summary_stats":{"2yr_mean_citedness":0,"h_index":1,"i10_index":0},"topic_share":[{"display_name":"Mechanical Engineering Research and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T13451","subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"},"value":0.0000806},{"display_name":"Advancements in Materials Engineering","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14096","subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"},"value":0.0000477},{"display_name":"Mechanical and Thermal Properties Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T13312","subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"},"value":0.0000256},{"display_name":"Engineering and Materials Science Studies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12959","subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"},"value":0.0000171},{"display_name":"Color perception and design","domain":{"display_name":"Social Sciences","id":"https://openalex.org/domains/2"},"field":{"display_name":"Psychology","id":"https://openalex.org/fields/32"},"id":"https://openalex.org/T12496","subfield":{"display_name":"Social Psychology","id":"https://openalex.org/subfields/3207"},"value":0.0000108},{"display_name":"Material Properties and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Materials Science","id":"https://openalex.org/fields/25"},"id":"https://openalex.org/T13129","subfield":{"display_name":"General Materials Science","id":"https://openalex.org/subfields/2500"},"value":0.0000084},{"display_name":"Neural Networks and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10320","subfield":{"display_name":"Artificial Intelligence","id":"https://openalex.org/subfields/1702"},"value":0.0000067},{"display_name":"Force Microscopy Techniques and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T10923","subfield":{"display_name":"Atomic and Molecular Physics, and Optics","id":"https://openalex.org/subfields/3107"},"value":0.0000053},{"display_name":"Semiconductor Lasers and Optical Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11429","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0000034},{"display_name":"Analytical Chemistry and Sensors","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Chemical Engineering","id":"https://openalex.org/fields/15"},"id":"https://openalex.org/T11472","subfield":{"display_name":"Bioengineering","id":"https://openalex.org/subfields/1502"},"value":0.000003},{"display_name":"Photonic and Optical Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10299","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0000018}],"topics":[{"count":2,"display_name":"Neural Networks and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10320","score":0.8549,"subfield":{"display_name":"Artificial Intelligence","id":"https://openalex.org/subfields/1702"}},{"count":1,"display_name":"Photonic and Optical Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10299","score":0.521,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":1,"display_name":"Force Microscopy Techniques and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T10923","score":0.1623,"subfield":{"display_name":"Atomic and Molecular Physics, and Optics","id":"https://openalex.org/subfields/3107"}},{"count":1,"display_name":"Semiconductor Lasers and Optical Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11429","score":0.5715,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":1,"display_name":"Analytical Chemistry and Sensors","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Chemical Engineering","id":"https://openalex.org/fields/15"},"id":"https://openalex.org/T11472","score":0.5508,"subfield":{"display_name":"Bioengineering","id":"https://openalex.org/subfields/1502"}},{"count":1,"display_name":"Color perception and design","domain":{"display_name":"Social Sciences","id":"https://openalex.org/domains/2"},"field":{"display_name":"Psychology","id":"https://openalex.org/fields/32"},"id":"https://openalex.org/T12496","score":0.1516,"subfield":{"display_name":"Social Psychology","id":"https://openalex.org/subfields/3207"}},{"count":1,"display_name":"Engineering and Materials Science Studies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12959","score":0.184,"subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"}},{"count":1,"display_name":"Material Properties and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Materials Science","id":"https://openalex.org/fields/25"},"id":"https://openalex.org/T13129","score":0.1685,"subfield":{"display_name":"General Materials Science","id":"https://openalex.org/subfields/2500"}},{"count":1,"display_name":"Mechanical and Thermal Properties Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T13312","score":0.9902,"subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"}},{"count":1,"display_name":"Mechanical Engineering Research and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T13451","score":0.9573,"subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"}},{"count":1,"display_name":"Advancements in Materials Engineering","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14096","score":0.9409,"subfield":{"display_name":"Mechanical Engineering","id":"https://openalex.org/subfields/2210"}}],"type":"company","type_id":"https://openalex.org/institution-types/company","updated_date":"2026-02-06T19:53:56.000Z","works_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210165530/works","works_count":8}