{"associated_institutions":[],"authors_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210159166/authors","cited_by_count":31,"collaborators_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210159166/collaborators","country_code":"US","counts_by_year":[{"cited_by_count":6,"oa_works_count":1,"works_count":1,"year":2018},{"cited_by_count":12,"oa_works_count":0,"works_count":1,"year":2013},{"cited_by_count":1,"oa_works_count":0,"works_count":1,"year":2011}],"counts_by_year_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210159166/counts_by_year","created_date":"2022-02-02T04:48:36.000Z","display_name":"Scientic (United States)","display_name_acronyms":[],"display_name_alternatives":["Scientic (United States)"],"geo":{"city":"Huntsville","country":"United States","country_code":"US","geonames_city_id":"4068590","latitude":34.722267150878906,"longitude":-86.67124938964844,"region":"Alabama"},"homepage_url":"http://scientic.com/","id":"https://openalex.org/I4210159166","ids":{"grid":"grid.456054.6","openalex":"https://openalex.org/I4210159166","ror":"https://ror.org/04mjjg550","wikidata":null,"wikipedia":""},"image_thumbnail_url":null,"image_url":null,"is_super_system":false,"lineage":["https://openalex.org/I4210159166"],"repositories":[],"roles":[{"id":"https://openalex.org/I4210159166","role":"institution","works_count":3}],"ror":"https://ror.org/04mjjg550","summary_stats":{"2yr_mean_citedness":0,"h_index":4,"i10_index":1},"topic_share":[{"display_name":"Radiation Effects in Electronics","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11005","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0000134},{"display_name":"Advanced Materials Characterization Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T13552","subfield":{"display_name":"Biomedical Engineering","id":"https://openalex.org/subfields/2204"},"value":0.0000133},{"display_name":"VLSI and Analog Circuit Testing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11032","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.0000103},{"display_name":"Electromagnetic Scattering and Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T10739","subfield":{"display_name":"Atomic and Molecular Physics, and Optics","id":"https://openalex.org/subfields/3107"},"value":0.0000099},{"display_name":"Integrated Circuits and Semiconductor Failure Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14117","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0000057},{"display_name":"Geophysical Methods and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11609","subfield":{"display_name":"Ocean Engineering","id":"https://openalex.org/subfields/2212"},"value":0.0000044},{"display_name":"Geophysical and Geoelectrical Methods","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Earth and Planetary Sciences","id":"https://openalex.org/fields/19"},"id":"https://openalex.org/T10572","subfield":{"display_name":"Geophysics","id":"https://openalex.org/subfields/1908"},"value":0.000004},{"display_name":"Metal and Thin Film Mechanics","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10377","subfield":{"display_name":"Mechanics of Materials","id":"https://openalex.org/subfields/2211"},"value":0.0000035},{"display_name":"Semiconductor materials and devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10472","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0000022}],"topics":[{"count":1,"display_name":"Metal and Thin Film Mechanics","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10377","score":0.9994,"subfield":{"display_name":"Mechanics of Materials","id":"https://openalex.org/subfields/2211"}},{"count":1,"display_name":"Semiconductor materials and devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10472","score":0.9975,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":1,"display_name":"Geophysical and Geoelectrical Methods","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Earth and Planetary Sciences","id":"https://openalex.org/fields/19"},"id":"https://openalex.org/T10572","score":0.9878,"subfield":{"display_name":"Geophysics","id":"https://openalex.org/subfields/1908"}},{"count":1,"display_name":"Electromagnetic Scattering and Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Physics and Astronomy","id":"https://openalex.org/fields/31"},"id":"https://openalex.org/T10739","score":0.9949,"subfield":{"display_name":"Atomic and Molecular Physics, and Optics","id":"https://openalex.org/subfields/3107"}},{"count":1,"display_name":"Radiation Effects in Electronics","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11005","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":1,"display_name":"VLSI and Analog Circuit Testing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11032","score":0.9992,"subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"}},{"count":1,"display_name":"Geophysical Methods and Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11609","score":0.9897,"subfield":{"display_name":"Ocean Engineering","id":"https://openalex.org/subfields/2212"}},{"count":1,"display_name":"Advanced Materials Characterization Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T13552","score":0.9999,"subfield":{"display_name":"Biomedical Engineering","id":"https://openalex.org/subfields/2204"}},{"count":1,"display_name":"Integrated Circuits and Semiconductor Failure Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14117","score":0.9993,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}}],"type":"company","type_id":"https://openalex.org/institution-types/company","updated_date":"2026-02-06T19:53:56.000Z","works_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210159166/works","works_count":3}