{"associated_institutions":[{"country_code":"US","display_name":"Intel (United States)","id":"https://openalex.org/I1343180700","relationship":"parent","ror":"https://ror.org/01ek73717","type":"company"}],"authors_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210158342/authors","cited_by_count":306215,"collaborators_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210158342/collaborators","country_code":"GB","counts_by_year":[{"cited_by_count":10,"oa_works_count":36,"works_count":43,"year":2026},{"cited_by_count":122,"oa_works_count":133,"works_count":188,"year":2025},{"cited_by_count":358,"oa_works_count":173,"works_count":242,"year":2024},{"cited_by_count":773,"oa_works_count":176,"works_count":265,"year":2023},{"cited_by_count":901,"oa_works_count":120,"works_count":204,"year":2022},{"cited_by_count":1824,"oa_works_count":136,"works_count":232,"year":2021},{"cited_by_count":3853,"oa_works_count":161,"works_count":290,"year":2020},{"cited_by_count":2650,"oa_works_count":109,"works_count":222,"year":2019},{"cited_by_count":3860,"oa_works_count":122,"works_count":287,"year":2018},{"cited_by_count":6497,"oa_works_count":100,"works_count":259,"year":2017},{"cited_by_count":5178,"oa_works_count":82,"works_count":241,"year":2016},{"cited_by_count":5073,"oa_works_count":47,"works_count":216,"year":2015},{"cited_by_count":5742,"oa_works_count":45,"works_count":214,"year":2014},{"cited_by_count":3171,"oa_works_count":36,"works_count":185,"year":2013},{"cited_by_count":2413,"oa_works_count":27,"works_count":139,"year":2012},{"cited_by_count":4767,"oa_works_count":35,"works_count":156,"year":2011},{"cited_by_count":3559,"oa_works_count":32,"works_count":175,"year":2010}],"counts_by_year_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210158342/counts_by_year","created_date":"2022-02-02T04:48:36.000Z","display_name":"Intel (United Kingdom)","display_name_acronyms":[],"display_name_alternatives":["Intel (United Kingdom)"],"geo":{"city":"Swindon","country":"United Kingdom","country_code":"GB","geonames_city_id":"2636389","latitude":51.543094635009766,"longitude":-1.77155601978302,"region":null},"homepage_url":"https://www.intel.co.uk/","id":"https://openalex.org/I4210158342","ids":{"grid":"grid.435529.c","openalex":"https://openalex.org/I4210158342","ror":"https://ror.org/058cxws58","wikidata":null,"wikipedia":"https://en.wikipedia.org/wiki/Intel"},"image_thumbnail_url":null,"image_url":null,"is_super_system":false,"lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"],"repositories":[],"roles":[{"id":"https://openalex.org/I4210158342","role":"institution","works_count":5251}],"ror":"https://ror.org/058cxws58","status":"active","summary_stats":{"2yr_mean_citedness":2.2681451612903225,"h_index":235,"i10_index":3300},"topic_share":[{"display_name":"Parallel Computing and Optimization Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10054","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.0032991},{"display_name":"Advanced Data Storage Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11181","subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"},"value":0.0024366},{"display_name":"VLSI and Analog Circuit Testing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11032","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.0021342},{"display_name":"Embedded Systems Design Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10904","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.002079},{"display_name":"Interconnection Networks and Systems","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10829","subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"},"value":0.0017871},{"display_name":"3D IC and TSV technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11527","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0016792},{"display_name":"Low-power high-performance VLSI design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10363","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0016405},{"display_name":"VLSI and FPGA Design Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11522","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.001535},{"display_name":"Radiation Effects in Electronics","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11005","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0014342},{"display_name":"Security and Verification in Computing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11424","subfield":{"display_name":"Artificial Intelligence","id":"https://openalex.org/subfields/1702"},"value":0.0013518},{"display_name":"Cloud Computing and Resource Management","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10101","subfield":{"display_name":"Information Systems","id":"https://openalex.org/subfields/1710"},"value":0.0012968},{"display_name":"Network Packet Processing and Optimization","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T12326","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.0012526},{"display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T12122","subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"},"value":0.0012353},{"display_name":"Computer Graphics and Visualization Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10481","subfield":{"display_name":"Computer Graphics and Computer-Aided Design","id":"https://openalex.org/subfields/1704"},"value":0.0012292},{"display_name":"Distributed systems and fault tolerance","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10772","subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"},"value":0.0011958},{"display_name":"Distributed and Parallel Computing Systems","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10715","subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"},"value":0.001175},{"display_name":"Ferroelectric and Negative Capacitance Devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12808","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0011127},{"display_name":"Integrated Circuits and Semiconductor Failure Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14117","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0010919},{"display_name":"Green IT and Sustainability","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T12238","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0010237},{"display_name":"Electronic Packaging and Soldering Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10460","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0009997},{"display_name":"Advancements in Photolithography Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11338","subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"},"value":0.0009824},{"display_name":"Software-Defined Networks and 5G","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10714","subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"},"value":0.0009092},{"display_name":"Graph Theory and Algorithms","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T12292","subfield":{"display_name":"Computer Vision and Pattern Recognition","id":"https://openalex.org/subfields/1707"},"value":0.0008888},{"display_name":"Experience-Based Knowledge Management","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T13514","subfield":{"display_name":"Artificial Intelligence","id":"https://openalex.org/subfields/1702"},"value":0.0008016},{"display_name":"3D Shape Modeling and Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10719","subfield":{"display_name":"Computational Mechanics","id":"https://openalex.org/subfields/2206"},"value":0.000775}],"topics":[{"count":853,"display_name":"Parallel Computing and Optimization Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10054","score":1,"subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"}},{"count":370,"display_name":"Advanced Data Storage Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11181","score":1,"subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"}},{"count":300,"display_name":"Embedded Systems Design Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10904","score":1,"subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"}},{"count":268,"display_name":"Semiconductor materials and devices","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10472","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":257,"display_name":"Distributed and Parallel Computing Systems","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10715","score":1,"subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"}},{"count":234,"display_name":"Interconnection Networks and Systems","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10829","score":1,"subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"}},{"count":224,"display_name":"Cloud Computing and Resource Management","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10101","score":1,"subfield":{"display_name":"Information Systems","id":"https://openalex.org/subfields/1710"}},{"count":211,"display_name":"VLSI and Analog Circuit Testing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11032","score":1,"subfield":{"display_name":"Hardware and Architecture","id":"https://openalex.org/subfields/1708"}},{"count":191,"display_name":"Integrated Circuits and Semiconductor Failure Analysis","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T14117","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":181,"display_name":"Low-power high-performance VLSI design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10363","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":171,"display_name":"Distributed systems and fault tolerance","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10772","score":1,"subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"}},{"count":161,"display_name":"Advancements in Semiconductor Devices and Circuit Design","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10558","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":142,"display_name":"Computer Graphics and Visualization Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10481","score":1,"subfield":{"display_name":"Computer Graphics and Computer-Aided Design","id":"https://openalex.org/subfields/1704"}},{"count":133,"display_name":"3D IC and TSV technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11527","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":122,"display_name":"Advanced Memory and Neural Computing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10502","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":118,"display_name":"Advanced Vision and Imaging","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10531","score":1,"subfield":{"display_name":"Computer Vision and Pattern Recognition","id":"https://openalex.org/subfields/1707"}},{"count":110,"display_name":"Radiation Effects in Electronics","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11005","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":100,"display_name":"Advanced MIMO Systems Optimization","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10148","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":100,"display_name":"VLSI and FPGA Design Techniques","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T11522","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":95,"display_name":"Electronic Packaging and Soldering Technologies","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Engineering","id":"https://openalex.org/fields/22"},"id":"https://openalex.org/T10460","score":1,"subfield":{"display_name":"Electrical and Electronic Engineering","id":"https://openalex.org/subfields/2208"}},{"count":90,"display_name":"Security and Verification in Computing","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11424","score":1,"subfield":{"display_name":"Artificial Intelligence","id":"https://openalex.org/subfields/1702"}},{"count":89,"display_name":"Software-Defined Networks and 5G","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10714","score":1,"subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"}},{"count":82,"display_name":"Advanced Neural Network Applications","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10036","score":1,"subfield":{"display_name":"Computer Vision and Pattern Recognition","id":"https://openalex.org/subfields/1707"}},{"count":82,"display_name":"Caching and Content Delivery","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T11478","score":1,"subfield":{"display_name":"Computer Networks and Communications","id":"https://openalex.org/subfields/1705"}},{"count":81,"display_name":"Formal Methods in Verification","domain":{"display_name":"Physical Sciences","id":"https://openalex.org/domains/3"},"field":{"display_name":"Computer Science","id":"https://openalex.org/fields/17"},"id":"https://openalex.org/T10142","score":1,"subfield":{"display_name":"Computational Theory and Mathematics","id":"https://openalex.org/subfields/1703"}}],"type":"company","type_id":"https://openalex.org/institution-types/company","updated_date":"2026-03-30T05:59:38.000Z","works_api_url":"https://scholar.citedevidence.com/v1/oa/institutions/I4210158342/works","works_count":5251}